This presentation highlights the new capabilities of RedHawk, the industry standard power noise and reliability sign-off solution that is FinFET ready. The new features include Distributed Machine Processing (DMP) for ultra large design simulation with sign-off accuracy, Chip Package Analysis (CPA) - the industry's first integrated chip-package co-simulation and co-analysis environment, and foundry certification for 16nm FinFET design. Learn more on our website: https://bit.ly/1t3lNZ1