As the industry shifts to FinFET devices, designs are more sensitive to noise, have higher power density, and interconnects are more susceptible to EM and thermal issues. To ensure robustness of these designs, today's methodology needs to include design for reliability. This presentation describes how RedHawk and Totem platforms enable accurate power noise and reliability sign off for standard cell and analog / mixed-signal IP all the way to SoC. Learn more on our website: https://bit.ly/1CW3FRT and https://bit.ly/1qk5Juj